Purpose :

Applicable :

Throughput(UPH) :

Chamber Type :

Load / Unload :

Chuck :

Equipment Control :

Process Feature

Process Temp :

Drain :

This equipment can do hard-PR removed

8”/6” Wafer PR Stripping / Flux clean

60 pcs (depend on high pressure stripping process)

Soaking tank/High pressure spin chamber/Final rinse chamber

2 sets ,open cassette type with wafer edge align

Edge grip chuck

Touch type IPC + PLC Control

·55 liter SUS soaking tank
·Soaking process with agitation and megasonic function
·HPC 60~200 kg/cm2
·DI/Solvent hi-jet process chamber, nozzle recipe is programmable
·DI/N2 2-Fluid final clean chamber, nozzle recipe is programmable
·N2：Jet Nozzle 5~7kg/cm2
·O2 extinguisher

Maximum 95 °C

By Gravitating drain with cooling tank